314 JOURNAL OF THE SOCIETY OF COSMETIC CHEMISTS with hardly any greasy feel and glaring appearance which are common to w/o type emulsion. 4. It is important that such surfactants to be used in these w/o emulsions have lameliar structures. 5. Amino acids are very effective in forming lameliar structure and contribute to preserve the tight interfacial atmosphere concentrating the surfactant at the inter- face. As a result, coalescence of water particles is prevented and stabilization of the w/o emulsion is achieved. 6. The stabilization mechanism of the w/o emulsions using the new method was elu- cidated through surface chemical investigation synthetically by means of X-Ray analysis, heat of solution, NMR, electron microscopy, etc. ACKNOWLEDGMENT The authors wish to express their sincere appreciation to Professor Kenjiro Meguro of Tokyo University of Science, Faculty of Science, Professor Stig Friberg of University of Missouri-Rolla, Mr. Yoichi Miya, Managing Director, and Dr. Takeo Kaneko and many others of Shiseido Co., Ltd, for their many useful suggestions and guidance. REFERENCES (1) R. M. Gattefose, Physicochemical study of the skin, Rev, Chim. ind., 83, 27-30, 127-30 (1939) Ibid., Some physicochemical aspects of Cosmetics, Tech. Ind. Chira., 284, 71-6 (1939). (2) D H. Powers, Effect of cosmetic ingredients and preparations on motsture loss from th• skin, Drug Cosmet. Ind., 82,233-4,239-40 (1958). (3) H. Czetch-Lmdenwald and Helmi A. F. Machroos, Water-in-oil emulsion ointments, Pharm. Zentralh., 98, 362-5 (1959). (4) E.J. Claret al,, Skin impedance and moisturization, J. Soc. Cosmet. Chera., 26, 337-53 (1975). (5) A. Fujita, The prediction of organic compounds by a conceptional diagram, Kagaku no Ryoiki., 11, 719- 25 (1957). (6) T. Kaneko eta[., Chemistry of Protein I., Kyoritu Publishers, Tokyo, Japan, 1969, Pp. 272-73. (7) K. Laden, Natural moisturizmg factors (NMF) in skin,Amer. Perfu,n, Cosmet., 82, 77-9 (1967). (8) M. Sekine and T. Kobayashi et al., "Handbook," Nikko Chemicals Co., Ltd., Tokyo, Japan, 1968, Pp. 1044-46.